
Tflex™ HP34
High Performance Gap Filler
Product Description
Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone formulation containing aligned graphite materials. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties.
Tflex™ HP34 Introduction Video
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Industries
- 5G Data Infrastructure
- 5G Telecom
- Data Infrastructure
- Aerospace/Defense
- Automotive
- Datacom
- Consumer Electronics
- Servers
Applications
- 5G Antenna Radome
- Wireless infrastructure
- Routers
- Servers
- Instrumentation/Test and measure
- Notebooks/Tablets/Portable Devices
- Smart Home Devices
- Telecom cabinets
Features and Benefits
- 34 W/mK bulk thermal conductivity
- Silicone Free formulation
- Maintains thermal performance under increased pressure
- Low contact resistance with mating surfaces
- Environmentally friendly solution that meets RoHS and REACH
Capabilities
Datasheets
Tflex HP34 Data Sheet Last updated08/22/23Technical Specification
Typical Properties
ColorGreyDensity (g/cc)2.30Operating Temperature Max (Celsius)125Operating Temperature Min (Celsius)-40Shelf Life1 years from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)34.00Thermal Resistance @10 psi Max (C-in2/W)0.212Thermal Resistance @10 psi Min (C-in2/W)0.106Thermal Resistance @30 psi Max (C-in2/W)0.185Thermal Resistance @30 psi Min (C-in2/W)0.059Thermal Resistance @50 psi Max (C-in2/W)0.110Thermal Resistance @50 psi Min (C-in2/W)0.048Electrical Properties
Volume Resistivity10 Ω-cmMechanical Properties
Hardness (Shore 00)50Dimensions
Thickness Max (Microns)5000.0Thickness Max (inches)0.200Thickness Max (mm)4500.00Thickness Min (Microns)0.2Thickness Min (inches)0.040Thickness Min (mm)1.00Compliance
Lead FreeYesREACHYesROHS CompliantYes