What Are SIL PAD® Thermal Materials?
SIL PAD® thermal conductivity products are soft, conformable thermal pads that improve heat dissipation in a range of electronic assemblies.
They minimize thermal resistance from the external package of a power semiconductor to the heat sink, electrically isolating the semiconductor from the heat sink and providing sufficient dielectric strength to withstand high voltage.
Designed to maximize thermal performance, they are also strong enough to resist puncture from the facing metal surface.
Supplied in rolls, Bergquist® SIL PAD® materials are also applicable to a fully automated pick-and-place process.